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•  Process technology

As Doping Bury Deep collector sinker Isolation Base Implant

P+ Emitter P Extension AL/Si(1%)

SiN/PSG SIN/PSG

 

•  Design ruler

Size: 4.0 X 6.0¦Ìm2

Masking layers from 9 to13

•  Specification of Parts

Parts

Parameter

Specification

Transistor

Working voltage

10 ¡« 60V

NPN Hfe

60 ¡« 250

NPN f T

700MHz

PNP Hfe

10 ¡« 50

PNP f T

10MHz


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